zouyang/phonerail
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phonerail/.claude/r2/_c4s1_live.json
T
zhou yang和Claude Opus 5 efcba30a0c R2 底板改 4 层（D15）：规则 / 几何 / 背面摆位 / 4 层布线与铺铜，已下发 
- 规则：铜层 2→4，差分 0.28/0.18，间距 0.15，过孔 0.3/0.2（rules_base）
- 几何：98×98 板框 + 4×M3，槽阵居中，L1 12V 大铜 + 指头（pcb_base）
- 摆位：五插槽留 L1，其余 133 件翻到 L4；背面镜像规则实测；Hub 放走廊 2、
  东移 2.5 mm；扇出圈 / 小件间距 1.5（去耦例外）/ 9 A 过孔阵禁区（place_base）
- 叠层按用户决定改为 L1 槽面 / L2 整层 +3V3 / L3 整层 GND / L4 器件面
- 布线：D± 七对按构造布通（USB3 掉头、USB1/2 北去掉头、USB4/5 东绕、
  J23 桥），+3V3 / GND / +12V 平面网每脚一孔，0.125 网格 + PathFinder
  开关（route_base、remote_route.ps1）；剩 37 个网待手工补
- 铺铜：4 层重写，入口链自南向北切段 + 断面校核（pour_base）；
  已下发布线 / 缝合孔 / 铜面轮廓，填铜未成功（待查）
- 工具：plot_base / plot_routes / shot_base，board_check 通孔两层都算

Co-Authored-By: Claude Opus 5 <[email protected]>
Claude-Session: https://claude.ai/code/session_0168Bu6SEx3cXXCJLkdnE6zB
2026-09-10 21:02:10 +08:00

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45,
788,
"【A】TP801 = P+，TP802 = P−：把主板原厂电池排线的 P+/P− 焊到这两个焊盘上（§13.5：焊 P+/P−，不是 B+/B−）。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"⚠ 顶针型号是占位：§22.3e 要的是工作高 2.0mm / 自由高 3.0~3.5mm /",
0,
10
],
[
45,
422,
" 行程 ≥1.0mm / 冠径 Ø1.5~2mm（吃掉 §22.3c 那 ±1mm 公差链），",
0,
10
],
[
45,
406,
" 现在这颗 9.0mm 自由高的明显不对，选型定了要换。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】TP801 = P+，TP802 = P−：把主板原厂电池排线的 P+/P− 焊到这两个焊盘上（§13.5：焊 P+/P−，不是 B+/B−）。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"⚠ 顶针型号是占位：§22.3e 要的是工作高 2.0mm / 自由高 3.0~3.5mm /",
0,
10
],
[
45,
422,
" 行程 ≥1.0mm / 冠径 Ø1.5~2mm（吃掉 §22.3c 那 ±1mm 公差链），",
0,
10
],
[
45,
406,
" 现在这颗 9.0mm 自由高的明显不对，选型定了要换。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】TP801 = P+，TP802 = P−：把主板原厂电池排线的 P+/P− 焊到这两个焊盘上（§13.5：焊 P+/P−，不是 B+/B−）。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"顶针 = YTC1P-2510-01（立创 C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm。",
0,
10
],
[
45,
422,
" 配 3.0mm 立柱 → 压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
406,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】TP801 = P+，TP802 = P−：把主板原厂电池排线的 P+/P− 焊到这两个焊盘上（§13.5：焊 P+/P−，不是 B+/B−）。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"顶针 = YTC1P-2510-01（立创 C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm。",
0,
10
],
[
45,
422,
" 配 3.0mm 立柱 → 压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
406,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】TP801 = P+，TP802 = P−：把主板原厂电池排线的 P+/P− 焊到这两个焊盘上（§13.5：焊 P+/P−，不是 B+/B−）。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"顶针 = YTC1P-2510-01（立创 C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm。",
0,
10
],
[
45,
422,
" 配 3.0mm 立柱 → 压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
406,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】J81：原厂电池排线在保护板焊点处剪断，4 个焊盘直焊（1=P+ 2=P− 3=TEMP 4=ID，间距 2.0）。保护板整块不要（§13.5 末尾）。",
0,
10
],
[
45,
772,
" R781 10k 代替保护板上的 NTC（模拟 25 °C），R791 68k 照抄保护板上的 ID 电阻，都对 P−。",
0,
10
],
[
45,
470,
"【B】四根顶针顶主板反面的 J601~J604（§13.3）。J604 是三键公共地，",
0,
10
],
[
45,
454,
" 直接接本路的电源返回地。驱动 MOS 在下板，这里只有顶针。",
0,
10
],
[
45,
438,
"顶针 = YTC1P-2510-01（立创 C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm。",
0,
10
],
[
45,
422,
" 配 3.0mm 立柱 → 压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
406,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】J81：原厂电池排线在保护板焊点处剪断，4 个焊盘直焊（1=P+ 2=P− 3=TEMP 4=ID，间距 2.0）。保护板整块不要（§13.5 末尾）。",
0,
10
],
[
45,
772,
" R781 10k 代替保护板上的 NTC（模拟 25 °C），R791 68k 照抄保护板上的 ID 电阻，都对 P−。",
0,
10
],
[
45,
522,
"【B】四根顶针顶主板反面的 J601~J604（§13.3），J604 是三键公共地，直接接本路的电源返回地。按键 = MOS 把触点对地短接（主板上已串 1k）。",
0,
10
],
[
45,
508,
" Q103/Q104/Q105 2N7002 由 C6-KEYS 的 74HC595 驱动（K1_PWR/VUP/VDN），栅极 1k 串阻 + 100k 下拉：复位期间 / 排针没插时不会误按（2026-09-06 从下板搬来，§26.23）。",
0,
10
],
[
45,
494,
" 顶针 YTC1P-2510-01（C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm；配 3.0mm 立柱压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
480,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
],
[
45,
806,
"【CH1 手机位】P+/P− 焊盘 + 电容组 + 侧键顶针 + EDL",
0,
13
],
[
45,
788,
"【A】J81：原厂电池排线在保护板焊点处剪断，4 个焊盘直焊（1=P+ 2=P− 3=TEMP 4=ID，间距 2.0）。保护板整块不要（§13.5 末尾）。",
0,
10
],
[
45,
772,
" R781 10k 代替保护板上的 NTC（模拟 25 °C），R791 68k 照抄保护板上的 ID 电阻，都对 P−。",
0,
10
],
[
45,
522,
"【B】四根顶针顶主板反面的 J601~J604（§13.3），J604 是三键公共地，直接接本路的电源返回地。按键 = MOS 把触点对地短接（主板上已串 1k）。",
0,
10
],
[
45,
508,
" Q103/Q104/Q105 2N7002 由 C6-KEYS 的 74HC595 驱动（K1_PWR/VUP/VDN），栅极 1k 串阻 + 100k 下拉：复位期间 / 排针没插时不会误按（2026-09-06 从下板搬来，§26.23）。",
0,
10
],
[
45,
494,
" 顶针 YTC1P-2510-01（C5221288）：自由高 3.5 / 行程 0.8 / 压到底 2.7 mm；配 3.0mm 立柱压缩 0.5mm（62% 行程，约 62g），屏蔽罩净空 1.6mm。",
0,
10
],
[
45,
480,
" 冠径只有 Ø0.9 球头，±1mm 落点公差靠首件实测校正（§22.3c / §22.3e）。",
0,
10
],
[
45,
205,
"【C】J61 是 1.25mm 2P 座，两根线焊到主板正面的 TP1204 / TP1205（§22.4）。",
0,
10
],
[
45,
189,
" U41 导通即短接两点 → 手机进 9008。串了 1.8k，短路电流只有 1mA。",
0,
10
],
[
45,
173,
" R741 100k 下拉紧挨开关放：ESP32 复位期间 74HC595 输出高阻，",
0,
10
],
[
45,
157,
" 靠它保证手机不会被误拉进 9008（§8.1 复位安全）。",
0,
10
]
],
"nRect": 0,
"nPoly": 0
}
在新工单中引用 查看 Git Blame 复制永久链接