- 规则:铜层 2→4,差分 0.28/0.18,间距 0.15,过孔 0.3/0.2(rules_base) - 几何:98×98 板框 + 4×M3,槽阵居中,L1 12V 大铜 + 指头(pcb_base) - 摆位:五插槽留 L1,其余 133 件翻到 L4;背面镜像规则实测;Hub 放走廊 2、 东移 2.5 mm;扇出圈 / 小件间距 1.5(去耦例外)/ 9 A 过孔阵禁区(place_base) - 叠层按用户决定改为 L1 槽面 / L2 整层 +3V3 / L3 整层 GND / L4 器件面 - 布线:D± 七对按构造布通(USB3 掉头、USB1/2 北去掉头、USB4/5 东绕、 J23 桥),+3V3 / GND / +12V 平面网每脚一孔,0.125 网格 + PathFinder 开关(route_base、remote_route.ps1);剩 37 个网待手工补 - 铺铜:4 层重写,入口链自南向北切段 + 断面校核(pour_base); 已下发布线 / 缝合孔 / 铜面轮廓,填铜未成功(待查) - 工具:plot_base / plot_routes / shot_base,board_check 通孔两层都算 Co-Authored-By: Claude Opus 5 <[email protected]> Claude-Session: https://claude.ai/code/session_0168Bu6SEx3cXXCJLkdnE6zB
38 行
319 B
JSON
38 行
319 B
JSON
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