{
 "frame": "顶视，板左下角原点，mm",
 "board_w": 44.0,
 "board_h": 67.0,
 "holes": {
  "H1": [
   1.4,
   9.9
  ],
  "H2": [
   0.7,
   27.3
  ],
  "H3": [
   1.7,
   38.7
  ],
  "H4": [
   41.9,
   1.9
  ],
  "H5": [
   57.4,
   41.2
  ],
  "H6": [
   64.6,
   28.1
  ],
  "H7": [
   64.8,
   32.4
  ]
 },
 "contacts_up": {
  "J600": [
   23.77,
   4.61
  ],
  "J1401": [
   48.76,
   2.48
  ],
  "TP1204": [
   45.36,
   5.58
  ],
  "TP1205": [
   42.57,
   5.73
  ]
 },
 "contacts_down": {
  "J600": [
   23.77,
   4.61
  ],
  "J601": [
   2.97,
   6.92
  ],
  "J602": [
   5.18,
   4.2
  ],
  "J603": [
   5.29,
   6.66
  ],
  "J604": [
   2.73,
   4.38
  ]
 },
 "hole_d": 2.0,
 "_source": "2026-09-06 测量底板扫描件反算（pcb2_measure_read.py，基准点单应，±0.5mm）。板长 67 = 裸板；描的轮廓 70.3 含 SIM 卡托伸出的 3.3mm（卡托在 u 大的那一端）",
 "side_key_contacts": {
  "PWR": [
   4.72,
   5.16
  ],
  "VUP": [
   3.42,
   6.37
  ],
  "VDN": [
   3.49,
   3.74
  ],
  "GND": [
   2.05,
   4.99
  ]
 },
 "_side_key_note": "2026-09-06 实测：中框金焊盘 + 7 孔配准反算，残差 0.57mm。菱形 相邻1.87/对角2.65，焊盘 Φ1.35。簇心 (3.42,5.07)，用户卡尺「H1 孔心到簇心 5mm」判死（另一条 2.88 的解已弃）。身份两条独立描述印证：GND 离短板边最近、PWR 与之正对、VDN 离长板边最近、VUP 次之。",
 "frame_boss_to_pad_mm": 1.0,
 "_frame_boss_note": "2026-09-06 用户实测：中框螺柱支撑面到侧键金焊盘面 1 mm = 载板面到主板贴合面该有的间隙"
}