(kicad_pcb
	(version 20260206)
	(generator "pcbnew")
	(generator_version "10.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(title_block
		(title "PhoneRail Board 2 - functional placement / unrouted")
		(rev "R2-FUNCTIONAL-PLACEMENT")
	)
	(layers
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		(4 "In1.Cu" signal)
		(6 "In2.Cu" signal)
		(2 "B.Cu" signal)
		(9 "F.Adhes" user "F.Adhesive")
		(11 "B.Adhes" user "B.Adhesive")
		(13 "F.Paste" user)
		(15 "B.Paste" user)
		(5 "F.SilkS" user "F.Silkscreen")
		(7 "B.SilkS" user "B.Silkscreen")
		(1 "F.Mask" user)
		(3 "B.Mask" user)
		(17 "Dwgs.User" user "User.Drawings")
		(19 "Cmts.User" user "User.Comments")
		(21 "Eco1.User" user "User.Eco1")
		(23 "Eco2.User" user "User.Eco2")
		(25 "Edge.Cuts" user)
		(27 "Margin" user)
		(31 "F.CrtYd" user "F.Courtyard")
		(29 "B.CrtYd" user "B.Courtyard")
		(35 "F.Fab" user)
		(33 "B.Fab" user)
		(39 "User.1" user)
		(41 "User.2" user)
		(43 "User.3" user)
		(45 "User.4" user)
	)
	(setup
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				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.2104)
				(material "FR4")
				(epsilon_r 4.3)
				(loss_tangent 0.02)
			)
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				(thickness 0.0175)
			)
			(layer "dielectric 2"
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				(thickness 1.0742)
				(material "FR4")
				(epsilon_r 4.3)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
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				(thickness 0.0175)
			)
			(layer "dielectric 3"
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				(thickness 0.2104)
				(material "FR4")
				(epsilon_r 4.3)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(copper_finish "ENIG")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting
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			(back yes)
		)
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		)
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			(back no)
		)
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		(pcbplotparams
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			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(footprint "PhoneRail:PAD-D1.5_MI8-KEY"
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