kicad:EasyEDA→KiCad 工程(Board1/Board2)、库、脚本与评审文档(IC 引脚、风扇、热、EDL 供电、布局规则)
Co-Authored-By: Claude Opus 5.5 <[email protected]>
这个提交包含在:
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{
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"board": "PhoneRail-Board2",
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"status": "TOPOLOGY_DEFINED_NOT_ROUTED",
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"sequence": [
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"upstream_usb",
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"hub_crystal_and_decoupling",
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"downstream_usb_pairs",
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"hub_control",
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"port_vbus",
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"power_and_ground_planes"
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],
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"reference_layers": {
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"F.Cu": "In1.Cu continuous ground for USB where F.Cu is used",
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"B.Cu": "In2.Cu continuous ground for USB where B.Cu is used"
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},
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"upstream": {
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"path": ["J23", "USB_ESD", "U32"],
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"layer": "B.Cu",
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"max_connector_fanout_mm": 3.0,
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"forbid_stubs": true
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},
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"downstream": {
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"source": "U32",
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"destinations": ["J31", "J32", "PHONE_PORT_3", "PHONE_PORT_4", "PHONE_PORT_5"],
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"layer": "F.Cu",
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"pair_length_mismatch_max_mm": 0.5,
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"same_via_count": true
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},
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"power": {
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"hub_3v3": "U32_each_supply_pin_to_local_decoupler_then_3V3_zone",
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"vbus": "per_port_switch_output_to_local_connector",
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"usb_ground_is_not_vbus_return": true
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},
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"review_gates": [
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"verify_port_net_mapping",
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"verify_reference_plane_continuity",
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"verify_pair_skew_and_via_symmetry",
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"verify_no_crossing_power_split",
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"verify_return_via_within_1mm_of_signal_via"
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]
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}
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